RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin and no solder mask
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
2. PCB Construction Details
| Parameter | Specification |
| Base Material | Rogers RO3010 |
| Layer Count | 4 layers |
| Board Dimensions | 35mm x 42mm |
| Minimum Trace/Space | 6/9 mils |
| Minimum Hole Size | 0.4mm |
| Via Type | Blind vias (L1-L2) |
| Finished Board Thickness | 2.7mm |
| Finished Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Tin |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Testing | 100% tested to IPC-Class-2 standards |
3. PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35 μm |
| Core Material | Rogers RO3010 Substrate | 1.27mm |
| Copper Layer 2 | Copper (1oz) | 35 μm |
| Bonding Layer | Prepreg 1060 x 1 | 0.05mm |
| Copper Layer 3 | Copper (1oz) | 35 μm |
| Core Material | Rogers RO3010 Substrate | 1.27mm |
| Copper Layer 4 | Copper (1oz) | 35 μm |
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
4. Key Features of Rogers RO3010
- Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, enabling efficient circuit miniaturization.
- Dissipation Factor (Df): 0.0022 at 10 GHz, ensuring minimal signal loss.
- Thermal Stability:
- Decomposition Temperature (Td) > 500°C for reliability in high-heat environments.
- Thermal Conductivity: 0.95 W/mK for effective heat dissipation.
- Dimensional Stability:
- Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z), ensuring compatibility with copper.
- Moisture Absorption: 0.05%, making it reliable in humid conditions.
5. Applications of the 4-Layer PCB
- Automotive Radar Systems
- Global Positioning Satellite (GPS) Antennas
- Cellular Telecommunications Systems
- Patch Antennas for Wireless Communications
- Satellite Communications
- Remote Meter Readers
- Power Backplanes
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
What Sets Us Apart?
- High Standards: All PCBs are produced to IPC-Class-2 standards and undergo rigorous testing to ensure quality.
- Global Availability: We deliver worldwide, ensuring timely support for your projects.
- Customer Support: We work closely with clients to provide customized solutions for their specific needs.
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
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RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin and no solder mask Images
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